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On-chip magnetic resonant coupling with multi-stacked inductive coils for chip-to-chip wireless power transfer (WPT)

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5 Author(s)
Sukjin Kim ; Terahertz Interconnection and Package Laboratory, EE, Korea Advanced Institute of Science and Technology (KAIST), 373-1 Guseong-dong, Yuseong-gu, Daejeon, Korea ; Myunghoi Kim ; Sunkyu Kong ; Jonghoon J. Kim
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In this paper, we present on-chip magnetic resonant coupling using single and multi-stacked inductive coils to enhance power transfer efficiency (PTE) of chip-to-chip wireless power transfer (WPT) system. The PTE is rigorously investigated and compared for three schemes of on-chip single and multi-stacked magnetic resonant coils. For on-chip magnetic resonant coupling, the PTE is significantly affected by an effective series resistance (ESR) of on-chip inductive coils at the transmitter and the receiver chip. It is verified through full-wave simulations that the PTE is improved by 38% using the scheme of a multi-stacked coil at both the transmitter and receiver chips, compared to the scheme of a single coil at both the transmitter and receiver chips.

Published in:

Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on

Date of Conference:

6-10 Aug. 2012