By Topic

TFSOI-can it meet the challenge of single chip portable wireless systems?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
W. M. Huang ; Wireless Subscriber Syst. Group, Motorola Inc., Mesa, AZ, USA ; D. J. Monk ; D. C. Diaz ; P. J. Welch
more authors

Tremendous progress in understanding and improving SOI material and devices has been made in recent years. The reduced junction capacitance and the minimal body-effect of SOI provides an inherent advantage for low-voltage low-power applications. Recent growth in the portable wireless communication market and the push for low cost solutions have driven the semiconductor industry into a race for the ultimate solution: a single chip radio capable of handling both the RF and baseband functions. In this paper, the applications of Thin-Film-Silicon-On-Insulator (TFSOI) to the different circuit elements of wireless communication systems are reviewed. The use of CMOS SOI devices as well as future development essential to realize the single chip radio are discussed

Published in:

SOI Conference, 1997. Proceedings., 1997 IEEE International

Date of Conference:

6-9 Oct 1997