Close category search window
 

Cortical potential imaging of somatosensory evoked potential induced by mechanical stimulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Hori, J. ; Grad. Sch. of Sci. & Technol., Niigata Univ., Niigata, Japan ; Kon, R.

The objective evaluation of somatic sensations is expected without a patient's subjective opinions to reduce social problems such as those related to lawsuits for nerve injuries or malingering. In this study, the somatosensory evoked potential (SEP) using the mechanical stimulations of the tactile sensation was measured and analyzed in spatiotemporal domains. The cortical potential mapping projected onto the realistic-shaped model was estimated to improve the spatial resolution of the SEP maps by application of cortical dipole layer imaging. The experimentally obtained results suggest that the spatiotemporal distributions of the SEPs reflect the differences for positions, strengths, and patterns of somatosensory stimulations.

Published in:
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE

Date of Conference: Aug. 28 2012-Sept. 1 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.