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Generating reduced order models via PEEC for capturing skin and proximity effects

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4 Author(s)
M. Kamon ; Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA ; N. Marques ; L. M. Silveira ; J. White

In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in generating low order models when PEEC-like models include volume filaments to accurately capture skin and proximity effects.

Published in:

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Date of Conference:

27-29 Oct. 1997