Referenced Items are not available for this document.
An overview of the recent advances in model reduction techniques of linear interconnect and packaging models for the purpose of simulation is given. The importance of different methods for accuracy, stability and generality are highlighted.
Published in:
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Date of Conference: 27-29 Oct. 1997
- Page(s):
- 251 - 254
- Meeting Date :
- 27 Oct 1997-29 Oct 1997
- Print ISBN:
- 0-7803-8649-3
- INSPEC Accession Number:
- 5808879
- Conference Location :
- Austin, TX
- Digital Object Identifier :
- 10.1109/EPEP.1997.634082
- Product Type:
- Conference Publications
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