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Accurate characterization of board level interconnects for high performance systems

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4 Author(s)
Lutz, R.D. ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Tripathi, A. ; Tripathi, V.K. ; Arabi, T.

Calibration and de-embedding techniques for time domain measurements associated with high speed off chip digital interconnects are presented. The techniques are demonstrated by measurements of skew, signal degradation, and crosstalk associated with typical interconnects in multilayered boards.

Published in:

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Date of Conference:

27-29 Oct. 1997