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The enhancement of static simulator package characterization through conductor segmentation

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3 Author(s)
G. Klemens ; Qualcomm Inc., San Diego, CA, USA ; V. Aparin ; K. Gard

A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.

Published in:

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Date of Conference:

27-29 Oct. 1997