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3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis

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5 Author(s)
Oh, S.Y. ; ULSI Res. Lab., Hewlett-Packard Co., Palo Alto, CA, USA ; Okasaki, K. ; Moll, J. ; Nakagawa, O.S.
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A 3D Global Interconnect Parameter ExtractoR (GIPER) has been developed to provide a practical extraction tool for the full-chip global critical path analysis. It extracts the interconnect parameters (R,C) of a typical global interconnect within several minutes per net on a HP 9000/755 workstation within 5% accuracy compared to full 3D numerical simulations.

Published in:

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Date of Conference:

27-29 Oct. 1997

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