Cart (Loading....) | Create Account
Close category search window
 

A Drop-on-Demand-Based Electrostatically Actuated Microdispenser

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ahamed, M.J. ; Univ. of Toronto, Toronto, ON, Canada ; Ben-Mrad, R. ; Sullivan, P.

This paper presents a noncontact drop-on-demand three-layer microdroplet generator based on electrostatic actuation. The dispenser is actuated via a deformable membrane that isolates the electrical field from the working fluid. The dispenser controlled droplet formation, frequency, size, and velocity within the ranges tested. Prototypes were fabricated using three-step deep reactive-ion etching and polydimethylsiloxane (PDMS) plasma activated bonding. Experiments verified stable droplet dispensing with a variance in subsequent droplet volume of less than 15% between droplets. The frequency of stable generation was 20 Hz, and the average volume of dispensed droplet was 1 nL. The dispenser operating range and the nondestructive actuation make it suitable for biological applications.

Published in:

Microelectromechanical Systems, Journal of  (Volume:22 ,  Issue: 1 )

Date of Publication:

Feb. 2013

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.