Cart (Loading....) | Create Account
Close category search window

Method of ohmic contact characterization from heat stability and contact resistance by example of contacts to SiC 6H

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Kudryk, Y.Y. ; Lashkaryov Inst. of Semicond. Phys. of NAS of Ukraine, Kiev, Ukraine

Using contacts to silicon carbide as an example, a method of ohmic contact characterization from heat stability and contact resistance is proposed. The method is based on the known empirical dependences of (i) contact resistivity on the semiconductor doping level and (ii) ohmic contact degradation on time and temperature.

Published in:

Microwave and Telecommunication Technology (CriMiCo), 2012 22nd International Crimean Conference

Date of Conference:

10-14 Sept. 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.