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Sintering of Silver–Aluminum Nanopaste With Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material

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3 Author(s)
Manikam, V.R. ; Energy Efficient & Sustainable Semicond. Res. Group, Univ. Sains Malaysia, Nibong Tebal, Malaysia ; Razak, K.A. ; Kuan Yew Cheong

A new Ag-Al nanopaste die-attach system for high-temperature use is introduced for the first time in this paper. The Ag-Al nanopaste with varying Al nanoparticle weight percent (wt%) is sintered at 380°C for 30 min. The effects of organic burn-off from the nanopaste in aiding solid-state fusion between the Ag and Al nanoparticles are investigated. The formation of Ag2Al and Ag3Al is detected in post-sintered nanopaste layers. Thermal and electrical conductivity measurements are also conducted to understand the properties of the post-sintered Ag-Al die-attach material in relation to increasing Al content. Thermal expansion analysis is performed to gauge the expansion of the post-sintered Ag-Al nanopaste against other high-temperature packaging components, as it is critical to avoid thermal stresses during device operation.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 12 )