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High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible Integration

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4 Author(s)
Jian Lu ; Res. Center for Ubiquitous MEMS, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan ; Nakano, Y. ; Takagi, H. ; Maeda, R.

In this paper, a flexible approach for chip to wafer high-accurate alignment and bonding is developed using a self-assembled monolayer (SAM). In this approach, a hydrophobic SAM, FDTS (CF3(CF2)7(CH2)2SiCl3), is successfully patterned by lift-off process on an oxidized silicon wafer to define the binding-sites. A certain volume of H2O (μ/mm2) is dropped and then spread on the non-coated hydrophilic SiO2 binding-sites for self-alignment of various microelectromechanical systems (MEMS) and IC chips by capillary force of H2O. Our results demonstrate that reasonably high alignment speed (in milliseconds) and excellent alignment accuracy ( ≤ 1 μm) are achieved when the difference in the measured contact angle between hydrophobic FDTS and hydrophilic binding-sites is >;70°. It is also found that the hydrophilic frame at the edge of each binding-site is effective in achieving successful self-alignment, while a super fine pattern at the center of the binding-site can be used to control the bonding strength. The effects of the Au/Cr thin film pattern on self-alignment are studied and discussed in this paper to enable the application of the above approach in various MEMS-IC integration processes, especially for low-cost mass production of wireless sensor nodes.

Published in:

Sensors Journal, IEEE  (Volume:13 ,  Issue: 2 )

Date of Publication:

Feb. 2013

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