Cart (Loading....) | Create Account
Close category search window
 

How Does Electrostatic Discharge Event Not Cause Polarity Flip in TMR Read Heads?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Marongmued, K. ; Dept. of Electr. Eng., Khon Kaen Univ., Khon Kaen, Thailand ; Sa-Ngiamsak, C.

Electrostatic Discharge (ESD) current causes both hard and soft failures on GMR read head technology; however, the current head technology such TMRs, the soft failure phenomenon such magnetization reversal has not been well understood. The previous published work only states that the soft failure does not occur on TMR technology; however none has pinpointed the cause of it. This work for the first time thoroughly explain the mechanism why ESD current does not cause a magnetization reversal on TMR read head instead ESD event likely induces only hard failure on TMRs. The explanation of this mechanism was conducted by investigating the important parameters such as Blocking Temperature (TB), Neel Temperature (TN), Curie Temperature (TC), and Electric Field Breakdown (EB) of a particular TMR head were monitored while an ESD current being applied by using Finite Element simulator. The results reveal that the oxide breakdown at the insulator layer occurs at a lower level of ESD current; for example this particular TMR head the oxide breakdown occurs at ESD peak current of 4 mA while it requires 6 mA to causes a magnetization reversal.

Published in:

Magnetics, IEEE Transactions on  (Volume:48 ,  Issue: 11 )

Date of Publication:

Nov. 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.