Cart (Loading....) | Create Account
Close category search window
 

Fabrication and Energy Band Alignment of n-ZnO/p-CuI Heterojunction

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Ding, K. ; Key Lab. of Optoelectron. Mater. Chem. & Phys., Fujian Inst. of Res. on the Struct. of Matter, Fuzhou, China ; Hu, Q.C. ; Chen, D.G. ; Zheng, Q.H.
more authors

N-ZnO/P-CuI heterojunctions are fabricated by growing undoped n-type ZnO thin films on p-type γ-CuI (111) single-crystal substrates using radio-frequency magnetron sputtering. The ZnO films are identified to be columnar structured with c-axis-preferred orientation by using X-ray diffraction and scanning electron microscope. Measurements of the energy band alignment of ZnO/CuI interface by using X-ray photoelectron spectroscopy result in a valence band offset of 1.74 eV and a conduction band offset of -1.37 eV, meaning a type-II band alignment at the interface. A typical diodelike behavior of the current-voltage curve indicates its possible applications in optoelectronics with further development.

Published in:

Electron Device Letters, IEEE  (Volume:33 ,  Issue: 12 )

Date of Publication:

Dec. 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.