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On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment

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2 Author(s)
Xiao Liu ; Department of Computer Science and Engineering, Chinese University of Hong Kong, Shatin, Hong Kong ; Qiang Xu

Excessive test power consumption and growing test data volume are both serious concerns for the semiconductor industry. Various low-power X-filling techniques and test data compression schemes were developed accordingly to address the above problems. These methods, however, often exploit the very same “don't-care” bits in the test cubes to achieve different objectives and hence may contradict each other. In this paper, we propose novel techniques to reduce scan capture power in linear decompressor-based test compression environment, by employing algorithmic solutions to fill and flip X-variables supplied to the linear decompressor. Experimental results on benchmark circuits demonstrate that our proposed techniques significantly outperform existing solutions.

Published in:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  (Volume:31 ,  Issue: 11 )