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Pad Assignment for Die-Stacking System-in-Package Design

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4 Author(s)
Wai-Kei Mak ; Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Yu-Chen Lin ; Chu, C. ; Ting-Chi Wang

Wire bonding is currently the most popular method for connecting signals between dies in system-in-package (SiP) design. Pad assignment, which assigns inter-die signals to die pads so as to facilitate wire bonding, is an important physical design problem for SiP design because the quality of a pad assignment solution affects both the cost and the performance of an SiP design. In this paper, we study a pad assignment problem, which prohibits the generation of illegal crossings and aims to minimize the total signal wirelength, for die-stacking SiP design. We first consider the two-die cases and die-stacks with a bridging die, and present a minimum-cost flow-based approach to optimally solve them in polynomial time. We then describe an approach, which uses a modified left-edge algorithm and an integer linear programming technique, for pyramid die-stacks with no bridging die. Finally, we discuss extensions of the two approaches to handle additional design constraints. Encouraging experimental results are shown to support our approaches.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:31 ,  Issue: 11 )

Date of Publication:

Nov. 2012

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