By Topic

Pad Assignment for Die-Stacking System-in-Package Design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wai-Kei Mak ; Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Yu-Chen Lin ; Chu, C. ; Ting-Chi Wang

Wire bonding is currently the most popular method for connecting signals between dies in system-in-package (SiP) design. Pad assignment, which assigns inter-die signals to die pads so as to facilitate wire bonding, is an important physical design problem for SiP design because the quality of a pad assignment solution affects both the cost and the performance of an SiP design. In this paper, we study a pad assignment problem, which prohibits the generation of illegal crossings and aims to minimize the total signal wirelength, for die-stacking SiP design. We first consider the two-die cases and die-stacks with a bridging die, and present a minimum-cost flow-based approach to optimally solve them in polynomial time. We then describe an approach, which uses a modified left-edge algorithm and an integer linear programming technique, for pyramid die-stacks with no bridging die. Finally, we discuss extensions of the two approaches to handle additional design constraints. Encouraging experimental results are shown to support our approaches.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:31 ,  Issue: 11 )