IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Journals & Magazines > Applied Physics Letters ...> Volume:101 Issue:16 Help

Publisher's Note: “Spin exchange interactions in hexagonal manganites RMnO3 (R = Tb, Dy, Ho, Er) epitaxial thin films” [Appl. Phys. Lett. 99, 052506 (2011)]

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Chen, Xiang-Bai ; Department of Applied Physics, Konkuk University, Chungju 380-701, Korea ; Thi Minh Hien, Nguyen ; Lee, D. ; Jang, S.-Y.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.4756929 

Published in:
Applied Physics Letters  (Volume:101 ,  Issue: 16 )

Date of Publication: Oct 2012

Page(s):
169901 - 169901-1
ISSN :
0003-6951
Digital Object Identifier :
10.1063/1.4756929
Product Type:
Journals & Magazines
Date of Current Version :
18 October 2012
Issue Date :
Oct 2012

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.