Skip to Main Content
A high power density wireless inductive power link targeting 3D-ICs and wireless testing is implemented in 65nm CMOS. Its operating frequency is 3.5GHz, the optimal frequency from the trade-off between delivered power and power loss. The link exploits high-Q inductors and resonant inductive coupling to boost the received voltage and maximize the delivered power. A power density of 0.61W/mm2 is achieved with 0.12×0.12mm2 coils and a 50μm separation.
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Date of Conference: 9-12 Sept. 2012