Referenced Items are not available for this document.
A high power density wireless inductive power link targeting 3D-ICs and wireless testing is implemented in 65nm CMOS. Its operating frequency is 3.5GHz, the optimal frequency from the trade-off between delivered power and power loss. The link exploits high-Q inductors and resonant inductive coupling to boost the received voltage and maximize the delivered power. A power density of 0.61W/mm2 is achieved with 0.12×0.12mm2 coils and a 50μm separation.
Published in:
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Date of Conference: 9-12 Sept. 2012
- Page(s):
- 1 - 4
- ISSN :
- 0886-5930
- E-ISBN :
- 978-1-4673-1554-8
- Print ISBN:
- 978-1-4673-1555-5
- INSPEC Accession Number:
- 13061601
- Conference Location :
- San Jose, CA
- Digital Object Identifier :
- 10.1109/CICC.2012.6330590
- Product Type:
- Conference Publications
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