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0.61W/mm2 resonant inductively coupled power transfer for 3D-ICs

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2 Author(s)
Sangwook Han ; Univ. of Michigan, Ann Arbor, MI, USA ; Wentzloff, D.D.

A high power density wireless inductive power link targeting 3D-ICs and wireless testing is implemented in 65nm CMOS. Its operating frequency is 3.5GHz, the optimal frequency from the trade-off between delivered power and power loss. The link exploits high-Q inductors and resonant inductive coupling to boost the received voltage and maximize the delivered power. A power density of 0.61W/mm2 is achieved with 0.12×0.12mm2 coils and a 50μm separation.

Published in:

Custom Integrated Circuits Conference (CICC), 2012 IEEE

Date of Conference:

9-12 Sept. 2012