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A new approach to designing electronic systems for operation in extreme environments: Part I - The SiGe Remote Sensor Interface

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20 Author(s)
Diestelhorst, R.M. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; England, T.D. ; Berger, R. ; Garbos, R.
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We have described the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (Figure 20) that took place over a span of 5 years and 8 fabrication cycles. It was conceived as part of the Multi-Chip Module (MCM) shown in Figure 21, which also includes a digital control chip for clocking, programming, and read-out. Further work beyond the scope of this was performed to validate the RSI for the extreme environmental conditions of a lunar mission, and individual blocks are presently.

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Aerospace and Electronic Systems Magazine, IEEE  (Volume:27 ,  Issue: 6 )