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Assembly Materials and Processes for High-Temperature Geothermal Electronic Modules

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5 Author(s)
Rui Zhang ; Electr. & Comput. Eng. Dept., Auburn Univ., Auburn, AL, USA ; Johnson, R.W. ; Vert, A. ; Tan Zhang
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Geothermal well logging and instrumentation applications require high-temperature logging tools and sensors with long-term operation capability at 300°C. Advanced SiC technology has enabled high-temperature electronics. To build functional systems operating at high temperatures, an interconnection and packaging technology must be developed to interconnect SiC devices and passive components. Off-eutectic AuSn has been evaluated for SiC and passive component attachment to PtPdAu/Au thick film metallization on alumina substrates and on thick film dielectric. A functional SiC-based oscillator module was fabricated and tested to demonstrate the assembly technologies developed for 300°C applications.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 11 )