By Topic

Assembly Materials and Processes for High-Temperature Geothermal Electronic Modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Rui Zhang ; Electrical and Computer Engineering Department, Auburn University, Auburn, AL, USA ; R. Wayne Johnson ; Alexey Vert ; Tan Zhang
more authors

Geothermal well logging and instrumentation applications require high-temperature logging tools and sensors with long-term operation capability at 300°C. Advanced SiC technology has enabled high-temperature electronics. To build functional systems operating at high temperatures, an interconnection and packaging technology must be developed to interconnect SiC devices and passive components. Off-eutectic AuSn has been evaluated for SiC and passive component attachment to PtPdAu/Au thick film metallization on alumina substrates and on thick film dielectric. A functional SiC-based oscillator module was fabricated and tested to demonstrate the assembly technologies developed for 300°C applications.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:2 ,  Issue: 11 )