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Scaling of Copper Seed Layer Thickness Using Plasma-Enhanced ALD and Optimized Precursors

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5 Author(s)
Jiajun Mao ; College of Nanoscale Science and Engineering, University at Albany-SUNY, Albany, NY, USA ; Eric Eisenbraun ; Vincent Omarjee ; Andrey Korolev
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Two recently developed precursors, AbaCus and Super AbaCus, are evaluated for use in ultralow temperature copper deposition by plasma enhanced atomic layer deposition. Film adhesion, platability, and process window evaluation demonstrate the strong capability of these precursors to overcome current metallization challenges.

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IEEE Transactions on Semiconductor Manufacturing  (Volume:26 ,  Issue: 1 )