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Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

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7 Author(s)
Durairaj, R. ; Dept. of Mech. & Mater. Eng., Univ. Tunku Abdul Rahman (UTAR), Kuala Lumpur, Malaysia ; Ashayer, R. ; Kotadia, H.R. ; Haria, N.
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The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.

Published in:

Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on

Date of Conference:

20-23 Aug. 2012