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A series of PI-EP composite materials under different imidization temperature gradients were prepared from 3,3'-diethyl-4,4'-diamino diphenyl methane (DEDA DPM), benzop-henone tetracarboxylic acid dianhydride (BTDA) and epoxy resin (E-51), and thermal imide process was used. Fourier transform infrared spectroscopy (FI-TR) indicated that the chemical reactions between poly(amic acid) and epoxy resin was existence and imide ring had formed. Heat-resistant property, dielectric property and mechanical property of PI-EP composite materials were tested, respectively. The results showed that the order of the materials heat resistance was 493 K>;523 K>;473 K>; 453 K, dielectric constant and dielectric loss were ranged from 3.30~3.68 and 1.2×10-3~1.3×10-2, the shear strength of PI-EP-493 K was the best and attained maximum value 8.962 MPa, the adhesive forces of all composite materials were at the higher level (one or two level), fully met the applied requirement.
Published in:
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Date of Conference: 24-28 July 2012
- Page(s):
- 1 - 4
- ISSN :
- 2160-9225
- Print ISBN:
- 978-1-4673-2852-4
- INSPEC Accession Number:
- 13057911
- Conference Location :
- Bangalore
- Digital Object Identifier :
- 10.1109/ICPADM.2012.6319003
- Product Type:
- Conference Publications
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