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Lessons learned in the semiconductor industry listing safety standards specified in tool procurement processes are presented. SEMI S2, Environmental, Health and Safety Guidelines for Semiconductor Manufacturing Equipment, and SEMI S8, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment, are used in procurement specifications for front-end-of-line (FEOL) wafer processing tools. The S2/S8 documents have been revised numerous times since their creation as SEMI standards in the 1990s and are being proposed as safety standards for procuring photovoltaic industry tools. Semiconductor manufacturing tools for 3D interconnect and through-silicon via (TSV) manufacturing include wafer processing equipment historically used in packaging and back-end processing. The SEMI S2 and S8 standards have not been universally accepted and often are not included as tool procurement specifications for packaging tools. This paper presents case studies on new 300 mm tools for 3D and TSV manufacturing that are considered packaging tools, with SEMI S2 and S8 referenced in the tool procurement specifications. The case studies address the following 3D tools: TSVetcher; copper plater for TSV fill; wafer polish/grind tool. Recommendations are made based on the readiness of packaging tools for inclusion as front-end processing tools to support 3D and TSV manufacturing. A process for engaging with packaging tool suppliers that ensures SEMI S2/S8 conformance is also proposed. Lessons learned in the semiconductor industry can be used to streamline the inclusion of SEMI S2 and S8 into photovoltaic tool procurement specifications. The process shared with the PV safety community stresses the importance of including all potential stakeholders involved in safety acceptance. The result can be zero non-conformances associated with PV manufacturing tools when SEMI S2 and S8 are specified.