Cart (Loading....) | Create Account
Close category search window

Through-silicon-via built-in self-repair for aggressive 3D integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Nicolaidis, M. ; TIMA Lab., UJF, Grenoble, France ; Pasca, V. ; Anghel, L.

Three-dimensional (3D) integration by die-/wafer-level stacking becomes a reality, as Through-Silicon-Via technologies emerge. However, poor reliability and yield of TSV interconnects remain major challenges of this promising technology. In this paper, we propose an efficient Built-In Self-Repair (TSV-BISR) strategy for TSV faults due to manufacturing and aging defects. After interconnect tests, we replace faulty TSVs with fault-free spares using shift operations. Among the benefits of this solution is that the self-repair signals are determined on-chip without any external intervention. Moreover, we show that with TSV-BISR better reparability is achieved with fewer spares than in existing TSV repair techniques. We also show that for 3D chips with interconnect reparability targets above 98% we reduce the area needed for spares and repair logic by up to 40%.

Published in:

On-Line Testing Symposium (IOLTS), 2012 IEEE 18th International

Date of Conference:

27-29 June 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.