Cart (Loading....) | Create Account
Close category search window

Characterization of Plasma Pencil Pulsed Discharge

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Skacelova, D. ; Dept. of Phys. Electron., Masaryk Univ., Brno, Czech Republic ; Slavicek, P.

In this paper, the optical emission spectroscopy (OES) of plasma pencil generated at atmospheric pressure with pulsed voltage was studied. Single-electrode and two-electrode configurations to approximate the conditions during various material treatment have been compared. By means of time-resolved OES, particle behavior during pulse duration, particularly atomic and molecular components represented by Ar lines and OH band, has been studied. The axial distribution of the rotational and the electron temperature showed that the presence of conductive material in plasma jet increased the rotational and electron temperature and even influenced the particle behavior inside the plasma nozzle. Furthermore, it was found that rotational temperature can be easily controlled by the duty cycle.

Published in:

Plasma Science, IEEE Transactions on  (Volume:40 ,  Issue: 11 )

Date of Publication:

Nov. 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.