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Effective in-line defect monitoring with variable wafer area coverage

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3 Author(s)
W. W. Kuo ; California Univ., Berkeley, CA, USA ; R. Akella ; D. Fletcher

The main purpose of this paper is to provide yield management personnel in semiconductor fabs an understanding of the impact of partial wafer area coverage when performing in-line defect monitoring. We present a heuristic approach of dynamic sampling with variable wafer area scanning, through a numerical example based on actual fab data

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI

Date of Conference:

10-12 Sep 1997