By Topic

Advanced yield enhancement: integrated yield analysis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Lee, F. ; Motorola Inc., Chandler, AZ, USA

Modern wafer fabs generate an immense volume of process and electrical test data for process monitoring, yield improvement, and device characterization. The data can be in the form of in-line process control measurements (CD, overlay, film thickness, etc.), defect wafer maps, die sort maps, and parametric test results. It is a significant challenge to manage and extract the information needed for process monitoring, device diagnostics, yield enhancement, and failure analysis. This paper describes how a Yield Management System (YMS) can be used to facilitate collection, extraction, and analysis of fab data. One of the primary functions of the YMS is to serve as a datahub for the collection of (patterned and unpatterned) wafer inspection data. The YMS provides a single interface from which fab personnel can access multiple data types such as defect data from in-line wafer inspections, wafer yield data from electrical test, equipment data from the WIP system, etc. The YMS also provides tools for chart creation, correlation, and analysis. Examples of how to use a YMS to improve fab monitoring and increase productivity are provided. The benefits and issues for implementing a yield management system are discussed

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI

Date of Conference:

10-12 Sep 1997