By Topic

Advanced methods for analysis of wafer-to-wafer yield variation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Pak, J. ; Submicron Dev. Center, Adv. Micro Devices, Sunnyvale, CA, USA ; Kittler, R. ; Hopper, B. ; Wen, P.

A fab-wide, wafer position tracking (WPT) system, along with advanced methods for data analysis, has been developed and implemented at AMD's Submicron Development Center (SDC). This system partitions the manufacturing flow into segments to efficiently monitor the entire process without adversely affecting cycle time or defectivity. A fully automated system of data analysis detects systematic relationships between wafer processing order and yield and/or parametric data. The system can detect linear, alternating, end-wafer, and other non-random trends. In addition, a spatial analysis technique has been incorporated for added sensitivity to small, localized phenomena. The modular nature of the WPT system allows it to be used with other wafer-level, data-gathering tools such as an in-situ particle monitor (ISPM). The analysis of wafer-to-wafer yield variation using this system has led to tightening of the wafer-level yield distribution and resulted in increased overall yield

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI

Date of Conference:

10-12 Sep 1997