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Alternative FIB cross section and laser ablation methods to improve failure analysis throughput of copper wire moisture related reliability failures

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4 Author(s)
W. F. Kho ; Freescale Semiconductor Malaysia, 2 Jalan SS8/2, Free Industrial Zone Sungei Way, 47300, Petaling Jaya, Selangor, Malaysia ; J. L. Leow ; Y. C. Cheah ; Y. W. Cheah

In analysis of copper wire moisture related reliability failures long hours are spent on the FIB tool. Two techniques are introduced to reduce the long analysis time: 1) An alternative FIB trenching method that reduces milling duration by 5X and, 2) A “FIB-free” approach using laser ablation.

Published in:

Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the

Date of Conference:

2-6 July 2012