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Alternative FIB cross section and laser ablation methods to improve failure analysis throughput of copper wire moisture related reliability failures

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4 Author(s)
Kho, W.F. ; Free Ind. Zone Sungei Way, Freescale Semicond. Malaysia, Petaling Jaya, Malaysia ; Leow, J.L. ; Cheah, Y.C. ; Cheah, Y.W.

In analysis of copper wire moisture related reliability failures long hours are spent on the FIB tool. Two techniques are introduced to reduce the long analysis time: 1) An alternative FIB trenching method that reduces milling duration by 5X and, 2) A “FIB-free” approach using laser ablation.

Published in:

Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the

Date of Conference:

2-6 July 2012