By Topic

Advanced Testing and Modeling of Magnetic Materials Including a New Method of Core Loss Separation for Electrical Machines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ibrahim, M. ; Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada ; Pillay, P.

This paper presents a new method for the separation of core loss components (hysteresis and eddy current) in laminations exposed to high-frequency excitations. Accurate separation of core losses is achieved by calculating the hysteresis losses at each frequency taking into account the nonuniform flux distribution inside the lamination. The results highlight that the assumption of constant hysteresis energy loss per cycle is only valid at low frequencies, where skin effect is negligible. The developed model is then used to study the effect of the annealing process on core loss components in laminations exposed to high-frequency excitations. Core loss measurements are performed on different laminations at several frequencies in the range of 20-4000 Hz. A comparison of the separated core loss components shows that a huge reduction in the hysteresis losses is achieved by annealing, while the annealing process increases the eddy-current loss component at high frequencies and high flux densities. The results are then analyzed by comparing the separated eddy-current loss with an analytical eddy-current loss model that accounts for the nonuniform distribution of the magnetic field.

Published in:

Industry Applications, IEEE Transactions on  (Volume:48 ,  Issue: 5 )