By Topic

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Bing Shi ; Univ. of Maryland, College Park, MD, USA ; Ankur Srivastava ; Avram Bar-Cohen

3D-ICs bring about new challenges to chip thermal management due to their high heat densities. Micro-channel based liquid cooling and thermal through-silicon-vias (TSVs) have been adopted to alleviate the thermal issues in 3D-ICs. Thermal TSV (which have no electrical significance), enables higher interlayer thermal conductivity thereby achieving a more uniform thermal profile. While somewhat effective in reducing temperatures, they are limited by the nature of the heat sink. On the other hand, micro-channel based liquid cooling is significantly capable of addressing 3D IC cooling needs but consumes a lot of extra power for pumping coolant through channels. This paper proposes a hybrid 3D-IC cooling scheme which combines micro-channel liquid cooling and thermal TSV with one acting as heat removal agent while the other enabling beneficial heat conduction paths to the micro-channel structures. The experimental results show that, the proposed hybrid cooling scheme provides much better cooling capability than using only thermal TSVs, while consuming 55% less cooling power compared with pure micro-channel cooling.

Published in:

2012 IEEE Computer Society Annual Symposium on VLSI

Date of Conference:

19-21 Aug. 2012