Cart (Loading....) | Create Account
Close category search window

Combating Write Penalties Using Software Dispatch for On-Chip MRAM Integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yong Li ; Dept. of Electr. & Comput. Eng., Univ. of Pittsburgh, Pittsburgh, PA, USA ; Yaojun Zhang ; Yiran Chen ; Jones, A.K.

Recent advances in the emerging memory technology magnetic RAM (MRAM) enrich the opportunities to build high density and low power embedded systems. One common way of utilizing MRAM is integrating it with conventional memories and distributing data to the appropriate type of memory to mitigate the high write penalty of MRAM. In this paper, we propose a software-based approach to identify data access characteristics and guide hardware to perform efficient data distribution. We use our technique to build an on-chip MRAM-SRAM hybrid cache and demonstrate an 86.8% reduction in leakage power, a 9.8% reduction in total power, and a 5% memory performance improvement, compared to a traditional static RAM (SRAM)-only cache.

Published in:

Embedded Systems Letters, IEEE  (Volume:4 ,  Issue: 4 )

Date of Publication:

Dec. 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.