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Optimization of geometrical parameters of optical interconnect module based on double side perforated silicon optical platform for high coupling efficiency

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5 Author(s)
Bong Kyu Jeong ; Grad. Program of Photonics & Appl. Phys., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea ; Ravindran, S. ; Eun Kyu Kang ; Sung Hyun Cha
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We demonstrated a new structure of optical interconnect module based on double side perforated silicon optical platform. This structure can eliminate the use of micro mirrors, lens, and guide pin, leading to a reduced packaging cost and volume. Simulation results show that the proposed structure can result in high coupling efficiency with relaxed permissible error for assembly.

Published in:

Opto-Electronics and Communications Conference (OECC), 2012 17th

Date of Conference:

2-6 July 2012