By Topic

Review of physical models for numerical simulation of semiconductor microsensors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Nathan, A. ; Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada ; Baltes, H. ; Allegretto, W.

With the increasing need for microsensors, development of simulation tools (based on adequate physical models to facilitate microsensor analysis and design) is a crucial task. The authors review the variety of physical approximations, model equations, and boundary conditions along with an outline of pertinent numerical procedures used in the numerical simulation of semiconductor microsensors. In particular, physical microsensors for thermal, optical, magnetic, and mechanical measurands are considered and selected simulation results are presented

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:9 ,  Issue: 11 )