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High performance ball grid array utilizing flip chip bonding on buildup printed circuit board

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3 Author(s)
Yamanaka, K. ; IBM Japan Ltd., Tokyo, Japan ; Mori, H. ; Tsukada, Y.

A flip chip bonding on a buildup Printed Circuit Board (PCB) has been emerging in a chip carrier area. As chip performance has been improving rapidly, it is now required to have a high performance chip carrier. This paper demonstrates a Ball Grid Array (BGA) application where a flip chip bonding on a multiple buildup layer PCB has an essential electrical performance for a high performance chip which has more than 1000 I/Os and more than 128 bit bus operating at 100 MHz. The effect of a ground plane and a power/ground pick up path design on crosstalk and ground bounce is discussed using SLC-BGA. Also discussed is a package electrical performance comparing various package types. We conclude that flip chip bonding on multiple buildup layer PCB technology is essential for a high performance chip carrier

Published in:

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Date of Conference:

13-15 Oct 1997