By Topic

The effects of flux materials on the moisture sensitivity and reliability of flip chip on board assemblies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
C. Beddingfield ; Adv. Interconnect Syst. Lab., Motorola Inc., Austin, TX, USA ; L. Higgins

This paper will discuss the non-proprietary aspects of the work-in-progress regarding developments in flux materials to improve the moisture-induced stress sensitivity of Flip Chip Plastic Ball Grid Array devices. Studies addressing the moisture characterization and pre-conditioning, using JEDEC Level 3, of assemblies built with four proprietary fluxes and two alternative underfill materials will be presented, This report includes the evaluation of the weight loss during a simulated die attach reflow profile for each flux type using thermogravimetric analysis. Also, the underfill adhesion strength to the die surface after assembly, after moisture preconditioning and after 48 hours of autoclave stressing will be discussed. The integrity of the solder joint corresponding to each flux type and measured using die pull techniques will also be presented. The effects of the experimental variables on underfill to die/substrate adhesion will also be reveiwed using C-SAM imaging methods

Published in:

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Date of Conference:

13-15 Oct 1997