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A built-in test circuit for open defects at interconnects between dies in 3D ICs

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5 Author(s)
Widianto ; Inst. of Technol. & Sci., Univ. of Tokushima, Tokushima, Japan ; Yotsuyanagi, H. ; Ono, A. ; Takagi, M.
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In this paper, a built-in test circuit is proposed to detect open defects that occur at interconnects between dies inside 3D ICs. An inverter gate is used in the test circuit as an open sensor. Open defects are detected by means of supply current of the inverter gate flowing when an AC voltage signal is provided to targeted interconnects as a stimulus. The interconnect at which an open defect occurs can be located with the test circuit. Feasibility of tests with the test circuit is examined by circuit simulation. The results promise us that open defects can be detected and also defective interconnects can be located with the test circuit.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012

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