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3D multiprocessor with 3D NoC architecture based on Tezzaron technology

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3 Author(s)
Jabbar, M.H. ; GIPSA-Lab., St. Martin d''Hères, France ; Houzet, D. ; Hammami, O.

In this paper, we describe the architecture and implementation of 3D multiprocessor with 3D NoC. The 2 tiers design is based on 16 processors communicating using a 4×2 mesh NoC and will be fabricated using Tezzaron technology with 130 nm Global Foundaries low power standard library. Due to the limitation when investigating NoC performance using simulation, the purpose of this work is to accurately measure NoC performances in real 3D chip when running mobile multimedia applications to evaluate the impact of 3D architecture compared to 2D.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012

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