Referenced Items are not available for this document.
We show that interconnection bonding of LSI chip to metallization on poly(ethylene naphthalate) (PEN) film can be realized by using cone-shaped compliant bump. We have investigated two designs of the counter electrode. One is simple metal pad electrode and the other is an electrode in which cross-shaped slit was formed. The bonding between the cone-shaped bump and the simple pad electrode was found to be realized at 150°C. More than 10,000 connections with about 100 mΩ/bump were formed. When the cross-shaped slit was employed, room-temperature bonding was achieved.
Published in:
3D Systems Integration Conference (3DIC), 2011 IEEE International
Date of Conference: Jan. 31 2012-Feb. 2 2012
- Page(s):
- 1 - 4
- Print ISBN:
- 978-1-4673-2189-1
- INSPEC Accession Number:
- 12943927
- Conference Location :
- Osaka
- Digital Object Identifier :
- 10.1109/3DIC.2012.6263012
- Product Type:
- Conference Publications
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