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Most advanced IC devices including packaging and substrates are requiring smart solution for wafer thinning/handling as well as stacking techniques to enhance performance and/or achieving ultimate assembling density. However existence thinning and handling technique or materials are facing difficulties in case of stand under high temperature or aggressive chemicals during processing e.g. via formation, insulation, via filling and stacking for 3D-assembling. In stead of them, an idea is applying high temperature and chemical resistant polyimide base temporary / permanent bonding adhesives to the series of process for eliminating difficulties. This paper presents assembly techniques and results which can be adopted for multiple types of advanced device and 3D-IC/module manufacturing.