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Cu-based bonding technology for 3D integration applications

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14 Author(s)
K. N. Chen ; Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan ; Z. Xu ; F. Liu ; C. T. Ko
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This paper summarizes and reports systematical studies of Cu-based bonding technology for 3D IC applications. Hybrid Cu-oxide and Cu-polymer bonding designs and schemes are investigated. Electrical performances and reliability of Cu bond structures provide important guidelines for future 3D IC applications.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012