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Cu-based bonding technology for 3D integration applications

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14 Author(s)
Chen, K.N. ; Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Xu, Z. ; Liu, F. ; Ko, C.T.
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This paper summarizes and reports systematical studies of Cu-based bonding technology for 3D IC applications. Hybrid Cu-oxide and Cu-polymer bonding designs and schemes are investigated. Electrical performances and reliability of Cu bond structures provide important guidelines for future 3D IC applications.

Published in:
3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference: Jan. 31 2012-Feb. 2 2012

Page(s):
1 - 4
Print ISBN:
978-1-4673-2189-1
INSPEC Accession Number:
12943889
Conference Location :
Osaka
Digital Object Identifier :
10.1109/3DIC.2012.6262974
Product Type:
Conference Publications

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