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Packaging of Single-Component Fractional Order Element

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2 Author(s)
Mondal, D. ; Dept. of Electr. Eng., Indian Inst. of Technol. Kharagpur, Kharagpur, India ; Biswas, K.

In this paper, packaging issue of a single-component fractional order element (FOE) is presented. Packaging is required for better longevity and miniaturization of dimensions. In addition, it helps in fabrication of a single-component FOE as a discrete element similar to the existing passive circuit elements. An alternate electrode (platinized silicon) for fabricating single-component FOE other than the existing copper electrode has been proposed for the first time in this paper. A comparative analysis has been carried out between the performances of packaged FOEs using copper and platinized silicon electrodes.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:13 ,  Issue: 1 )

Date of Publication:

March 2013

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