By Topic

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

11 Author(s)
L. Dussopt ; CEA-LETI, Minatec campus, 38054 Grenoble, France ; Y. Lamy ; S. Joblot ; J. Lantéri
more authors

A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57–66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

Published in:

Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International

Date of Conference:

17-22 June 2012