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A new technique for testing TAB bonded LSIs in the gigahertz frequency range

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3 Author(s)
Kon, T. ; NTT Appl. Electron. Lab., Tokyo, Japan ; Sasaki, S. ; Konno, R.

A testing technique for tap automated bonding (TAB) bonded LSIs operating in the gigahertz frequency is described. With this technique, a TAB tape is sandwiched between test tools so as to assume a stripline configuration during testing. This technique enables the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. The maximum testing bit rate achieved reached 5 Gb/s, which is 2.5 times greater than with the conventional technique

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )