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Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management

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5 Author(s)
Rich, E.L., III ; Westinghouse Electr. Corp., Baltimore, MD, USA ; Martin, A.J. ; Lengel, T.M. ; Stewart, J.J.
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A hybrid integrated regulator/modulator with a digital and analog signal bus system for power conditioning of a transmit/receive module having a density figure of merit of 69 W/in3 and 845 W/lb is described. High-density multichip power conditioning modules were designed using a low-temperature cofired ceramic as the base substrate. The design was fabricated, tested, and delivered. Design considerations, guidelines, and fabrication concerns are discussed. Aspects discussed include high-density computer aided design and packaging concepts, the regulator/modulator approach to power conditioning, design guidelines and substrate characteristics of the glass-ceramic material system, thermal management solutions for high-powered chips, and reliability and performance data on the finished substrate and module. Emphasis is on the improved processing of blind thermal slots and cofired top metallization. An appreciable improvement of thermal conductivity with thermal vias was achieved

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )