Cart (Loading....) | Create Account
Close category search window
 

Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Rich, E.L., III ; Westinghouse Electr. Corp., Baltimore, MD, USA ; Martin, A.J. ; Lengel, T.M. ; Stewart, J.J.
more authors

A hybrid integrated regulator/modulator with a digital and analog signal bus system for power conditioning of a transmit/receive module having a density figure of merit of 69 W/in3 and 845 W/lb is described. High-density multichip power conditioning modules were designed using a low-temperature cofired ceramic as the base substrate. The design was fabricated, tested, and delivered. Design considerations, guidelines, and fabrication concerns are discussed. Aspects discussed include high-density computer aided design and packaging concepts, the regulator/modulator approach to power conditioning, design guidelines and substrate characteristics of the glass-ceramic material system, thermal management solutions for high-powered chips, and reliability and performance data on the finished substrate and module. Emphasis is on the improved processing of blind thermal slots and cofired top metallization. An appreciable improvement of thermal conductivity with thermal vias was achieved

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )

Date of Publication:

Dec 1990

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.