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Monte Carlo thermal optimization of populated printed circuit board

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3 Author(s)
Eliasi, R. ; Dept. of Mech. Eng., Ben-Gurion Univ. of the Negev, Beer Sheva, Israel ; Elperin, T. ; Bar-Cohen, A.

The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite element code called ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing and cluster optimization methods and the effect of the relevant parameters on board reliability are discussed

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )