By Topic

Design, Fabrication, and Characterization of a High-Heating-Efficiency 3-D Microheater for Catalytic Gas Sensors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Lei Xu ; State Key Laboratory of Transducer Technology, and the Science and Technology on Micro-system Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China ; Yuchen Wang ; Hong Zhou ; Yanxiang Liu
more authors

In this paper, a novel 3-D microheater has been developed in order to improve the performance of catalytic gas sensors. The 3-D microheater consists of a platinum heater embedded in a concave-shaped membrane which was formed in twice wet-chemical anisotropic etching with photoresist-spray-coating-based liftoff process. Based on the 3-D microheater, a catalytic gas sensor with a paired detector and compensator was developed by sol-gel process, introducing γ-Al2O3-supported 15-wt % Pd as catalyst. Finite element method analysis results suggest that sensitivity of the catalytic gas sensor can be improved by loading more catalyst on the active area and concentrating more combustion heat inside the concave-shaped membrane. Test results indicate that a high heating efficiency has been achieved. Power per active area of the 3-D microheater is only half or less than that of current 2-D microheaters. Sensor response to methane shows that the sensitivity to 50% lower explosive limit CH4 was 12 mV/ % CH4.

Published in:

Journal of Microelectromechanical Systems  (Volume:21 ,  Issue: 6 )