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Development of a 3-D Process Technology for Wafer-Level Packaging of MEMS Devices

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2 Author(s)
Woo-Chang Choi ; MEMS/NANO Fabrication Center, Busan, South Korea ; Hyun-Jin Choi

This paper presents a simple and low-cost 3-D process technology for the wafer-level packaging (WLP) of microelectromechanical system (MEMS) devices. A small-sized WLP (1.0 × 1.0 × 0.35 mm) with a hermetically sealed cavity for the moving parts of MEMS devices was fabricated by using specially designed processes. The WLP was developed using three key techniques: through-wafer interconnection, wafer bonding, and bilateral face-MEMS fabrication. The expense and complexity of processes such as silicon deep reactive ion etching and electroplating that arise from bilateral processing for through-wafer interconnection were overcome by using bulk micromachining technology. The fabricated WLP chips with a bonding area of 0.314 mm2 showed an average shear strength of 9.74 kg/mm2 and a leak rate less than 7 × 10-10 mbar.cc/sec. In addition, the chips had less than 0.1 dB insertion loss before and after reliability testing. This newly developed 3-D process technology is a good candidate for WLP MEMS fabrication because it is simple and cost-effective.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 9 )

Date of Publication:

Sept. 2012

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